• DISCO Corporation

    Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipmentdisco corporation equipment for qrindinq of,disco corporation equipment for qrindinq of. About DISCO: DISCO HITEC EUROPE . It is the right place for needs related to the sale or maintenance of any dicing machine and blades, grinding equipment, laser cutter, DISCO Corporation. learn more

  • DISCO Corporation SEMI

    DISCO Corporation. Join Date: Jan 1, 1976. Company ID: 10462. Dicing equipment; grinding equipment and related consumables for materials processing. Primary Industry. Semiconductor. Primary Product Category. Equipment and Sub-Systems. Primary Product Sub Category.Product Information Grinder and Polisher DISCO Corporation,Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*.

  • Disco Corporation Wikipedia

    DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damageDISCO precision machines dicing-grinding service,Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

  • Dicing-Grinding Service by DISCO dicing-grinding service

    Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.Solutions Support Dicing and Grinding Service DISCO,This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

  • Solutions DISCO Corporation

    The chargeable processing service, which DISCO is providing, is in response to the demand for small-lot production, but where purchasing precision equipment is not practical. This service is effective for manufacturing samples when developing a new product or prototype, providing process technology or supporting small-lot production.DISCO Corporation,Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers, and DISCO corporate information is also

  • DISCO Corporation SEMI

    DISCO Corporation. Join Date: Jan 1, 1976. Company ID: 10462. Dicing equipment; grinding equipment and related consumables for materials processing. Primary Industry. Semiconductor. Primary Product Category. Equipment and Sub-Systems. Primary Product Sub Category.Dicing Before Grinding (DBG) DISCO Technology Advancing,In DBG, first a half-cut is performed on the wafer with a dicing saw. Then, wafer thinning and die separation are performed at the same time during grinding. Because the thinned wafers are never transferred in DBG, wafer-level breakage is greatly reduced.

  • Dicing and Grinding Using the Disco Corporation

    Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.Thin Wafer Processing and Dicing Equipment Market-Growth,Jun 12, 2020· – TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

  • Disco Corporation Production Equipment Japan

    Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 +81 3 45901111: disco.co.jp Japan : Staff Information No. Staff Wafer Grinding Equipment, Wafer Polishing Machine Last Update 10 Apr 2020Solutions Support Dicing and Grinding Service DISCO,This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

  • DISCO precision machines dicing-grinding service

    Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.DISCO machines and supplyer's equipment dicing-grinding,DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected]

  • Dicing-Grinding Service by DISCO dicing-grinding service

    Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.Thin Wafer Processing and Dicing Equipment Market Growth,TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

  • DISCO CORPORATION (DSCSY) Company Profile & Facts Yahoo

    Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. and other products, such as accessory equipment, as well as framesGrinding Mills Servicing disco grinding equipment-Henan,Disco Grinding Equipment. Disco grinding equipment DISCO GRINDER For Sale used second hand surplus This is a global marketplace for buyers and sellers of used surplus or refurbished DISCO GRINDER If you are looking to buy or sell second hand DISCO GRINDER please visit EquipMatching DISCO grinding and polishing machines and abrasive +

  • 6146.T DISCO CORPORATION Profile Reuters

    DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as DISCO Corporation Company Profile Office Locations,Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

  • DISCO precision machines dicing-grinding service

    Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.DISCO Corporation Company Profile Office Locations,Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

  • DISCO CORPORATION (6146.T) Company Profile & Facts Yahoo

    See the company profile for DISCO CORPORATION (6146.T) including business summary, industry/sector information, number of employees, business summary, corporate governance, key executives andDisco Corporation Production Equipment Japan,Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 +81 3 45901111: disco.co.jp Japan : Staff Information No. Staff Wafer Grinding Equipment, Wafer Polishing Machine Last Update 10 Apr 2020

  • 6146.T DISCO CORPORATION Profile Reuters

    DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING,Apr 08, 2020· Global Semiconductor Wafer Polishing and Grinding Equipment Market Overview: The Global Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 355.54 million in 2019, and it is expected to reach 452.57 million by 2025, registering a CAGR of 4.1% during the forecast period (2020 2025).

  • Processing of the Sealing Resin and Mold Resin X Grinding

    In recent years, wafer-level CSP (Chip Size Packages) are sealed at the wafer level. Thus, in addition to DISCO dicing saws for singluation, DISCO grinders (grinding equipment using grinding wheels) for the low-profiling of sealing resin are also often used.Disco Hi-Tec UK Ltd: precision polishing machine,polishing,Dicing and Grinding Service SiteMap About DISCO Investors CSR DISCO HOME > Solutions > Solutions Support > Dicing and Grinding Service Solutions Dicing and Grinding Service This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI

  • DISCO machines and supplyer's equipment dicing-grinding

    DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D-85551 Kirchheim b. München Germany. Phone +49 89 909 03-0 Fax +49 89 909 03-199. [email protected] of Singulation Techniques,Foundry equipment suppliers to assembly. yg Suppliers includes PlasmaThermhas partnered with Disco Panasonic Sept 28, 2017 [email protected] 39 SPTS Sept 28, 2017 [email protected] 40 Acknowledgement: Disco Hi-Tec America, Inc. discousa [email protected]& [email protected]

  • DISCO CORP. Registered Shares o (D65.SG) Company Profile

    See the company profile for DISCO CORP. Registered Shares o (D65.SG) including business summary, industry/sector information, number of employees, business summary, corporate governance, keyDisco Corp (6146) Quote Morningstar,Disco Corp is a Japan-based company that manufactures and distributes precision processing and other manufacturing equipment. The firm's product portfolio includes dicing saws, laser saws

  • DSCSY Company Profile for DISCO CORPORATION MSN Money

    DISCO CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as Intel Announces 2019 Supplier Continuous Quality,DISCO Corporation (with Distinguished Performance in Safety): Cutting, grinding and polishing equipment, consumables and services Fujimi Corporation: Innovative